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FPC软板设计规范大全:十年工程师的经验总结与实用设计指南!

( 2026-10-24 阅读 11805)

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<p style="line-height: 1.8;" data-pm-slice="0 0 []">明明线路设计没问题，板子做出来却发现：<strong>过孔不合理，阻抗不达标</strong>……</p>
<p style="line-height: 1.8;">那些看似不起眼的设计细节，到了生产环节就可能会变成大麻烦，轻则影响产品装配，重则板子返工、报废！</p>
<p style="line-height: 1.8;"><strong>那设计<strong class="js_darkmode__0">FPC</strong>，有哪些容易踩坑的地方呢？</strong></p>
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<p style="line-height: 1.8;">基于嘉立创FPC工厂多年的实战生产经验，本文系统梳理了<strong><span class="js_darkmode__1">FPC的全套核心设计规范</span></strong>，包含钻孔、线路、补强、阻抗……等各个环节。</p>
<p style="line-height: 1.8;">正在做FPC设计的工程师，建议先收藏，再对照检查！</p>
<h2 style="line-height: 1.8;"><span style="font-size: 20px; color: #1871ff;">一、FPC实战设计规范</span></h2>
<p style="line-height: 1.8;"><span class="js_darkmode__5">FPC的布局布线及常规要求与PCB是一样的，但还需兼顾电气性能与可制造性，以下为核心要点分类说明。</span></p>
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<section><span style="color: #1871ff; font-size: 18px;"><strong title="" data-original-title="">1.</strong><strong data-brushtype="text">钻孔设计</strong></span></section>
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<p style="line-height: 1.8;"><span class="js_darkmode__13">1）过孔与防焊开窗间距需保证</span><strong class="js_darkmode__14">0.2mm以上</strong><span class="js_darkmode__15">，防止孔边露铜；</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__16"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/2793238f-6cde-428f-b800-2ae0210c22b9-file" width="554" height="233"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__17">2）<span style="color: #1871ff;"><strong>FPC不建议设计盘中孔</strong></span>，因无法做树脂塞孔，易出现漏锡或少锡问题。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__18"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/fe5f9efe-1b0e-4810-8b43-b82d31790c01-file" width="522" height="405"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__19">3）<span style="color: #1871ff;"><strong>非金属化孔需设计在板框同一层</strong></span>，且保证板框层不能有其它杂乱的元素</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__20"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/60bffd19-b12a-41aa-810f-0e2051268206-file" width="553" height="220"></span></p>
<p style="text-align: center; line-height: 1.8;"><span class="js_darkmode__20" style="font-size: 14px; color: #888888;">槽孔与板框没有放在同一层，导致漏做</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__21">4）过孔不能设计成一排，需上下或左右错开</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__22"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/f679fb0b-6554-4cb4-80c7-2f0be80dbcfc-file" width="1034" height="305"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__23">5）<strong>板边半孔：</strong></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__24">A.过锡孔及半孔直径≥0.3mm，过锡孔需要左右错开加，不能加成一排。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__25">B.保证过锡孔或半孔外径比内径大0.2mm以上</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__26"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/fec9d4c5-01f2-4b36-952d-7790821d4508-file" width="878" height="366"></span></p>
<p style="text-align: center; line-height: 1.8;"><span class="js_darkmode__26" style="font-size: 14px; color: #888888;">左图独立半孔焊环板内长度只有0.17mm，成型时焊盘容易被切掉</span></p>
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<section><span style="font-size: 18px; color: #1871ff;"><strong title="" data-original-title="">2.</strong><strong data-brushtype="text">线路设计</strong></span></section>
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<p style="line-height: 1.8;"><strong>1）线宽线距设计要求</strong></p>
<p style="line-height: 1.8;"><span class="js_darkmode__34">① 铜厚12um（0.33oz)：3/3mil（极限2/2mil）  </span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__35">② 铜厚18um（0.5oz)：3.5/3.5mil </span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__36">③ 铜厚35um（1oz)：4/4mil</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__37">2）<strong>避免设计独立焊盘</strong>，尤其是两面重叠的焊盘（FPC中间基材仅25um，易脱落）建议设计成阻焊膜压PAD形式。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__38"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/a135a819-4847-4141-a67c-ff6166d741c0-file" width="1080" height="667"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__39">3）线路稀疏时，拐角处易撕裂，建议在板边<strong>增加防撕裂铜</strong><strong>条</strong>或<strong>空旷区铺网格铜</strong>；</span></p>
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<p style="line-height: 1.8;"><span class="js_darkmode__40">4）贴片焊盘到线路间距需<strong>≥0.2mm</strong></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__41"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/5e56c6c6-099e-4854-a767-1d1e1a138e42-file" width="938" height="353"></span></p>
<p style="text-align: center; line-height: 1.8;"><span class="js_darkmode__41" style="color: #888888; font-size: 14px;">BGA焊盘到线间距仅0.1mm</span></p>
<p style="line-height: 1.8;"><strong>5）通孔焊盘设计要求</strong></p>
<p style="line-height: 1.8;"><span class="js_darkmode__42">① 过孔外径必须比内径大0.2mm以上</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__43">② 插件孔外径需比内径大0.4mm以上</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__44"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/2da8cb3d-782f-45bc-9025-81099a4a0087-file" width="718" height="340"></span></p>
<p style="text-align: center; line-height: 1.8;"><span class="js_darkmode__44" style="font-size: 14px; color: #888888;">过孔外径只比内径大0.1mm，蚀刻后孔内无铜也无焊环，全部开路</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__45">6）焊盘与走线相交处需要加泪滴</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__46"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/bcb2d210-0e08-4b24-8de1-e3dfae58122f-file" width="686" height="344"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__47">7）大地铜尽量设计<strong>45度网格状</strong>，网格线宽0.35mm,线边到线边间距0.35mm，增加柔性</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__48"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/9d38f9f7-49f9-4772-ae4b-02fca743605f-file" width="594" height="282"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__49">8）<strong>贴片焊盘需设计为SMD形式</strong>，即阻焊定义PAD尺寸，阻焊开窗比线路焊盘小，FPC中俗称压PAD设计</span></p>
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<section><span style="color: #1871ff; font-size: 18px;"><strong title="" data-original-title="">3.</strong><strong data-brushtype="text">阻焊设计</strong></span></section>
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<p style="line-height: 1.8;"><span class="js_darkmode__56">1）FPC采用PI覆盖膜作为阻焊层，颜色可选</span><strong>黄色、黑色、白色、透明色</strong></p>
<p style="line-height: 1.8;"><span class="js_darkmode__57">2）嘉立创默认<span data-pm-slice="1 1 ["para",{"tagName":"section","attributes":{"data-role":"outer","label":"edit by 135editor","style":"margin: 0px;","data-pm-slice":"0 0 []"},"namespaceURI":"http://www.w3.org/1999/xhtml"},"para",{"tagName":"section","attributes":{"data-role":"paragraph","style":"text-align: center;"},"namespaceURI":"http://www.w3.org/1999/xhtml"},"para",{"tagName":"p","attributes":{"style":"text-align:left;margin: 10px 10px 20px;line-height: 1.75;display: block;"},"namespaceURI":"http://www.w3.org/1999/xhtml"},"node",{"tagName":"span","attributes":{"style":"font-size: 14px;letter-spacing: 0.5px;color: #000000;"},"namespaceURI":"http://www.w3.org/1999/xhtml"}]">过孔</span>按阻焊盖油制作，如果要<strong>开窗需要特别备注</strong></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__59"><strong><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/d5018478-b4bf-48db-90aa-f72d33f07ac5-file" width="537" height="341"></strong></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__60">3）两个焊盘之间需要有<strong>0.5mm以上</strong>才能保留阻焊桥(如一定要保桥，需要做激光开窗工艺）。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__61"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/eda31fcb-f724-4914-b09d-0909031bea1e-file" width="1046" height="444"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__62">4）阻焊开窗到铜距离需有<strong>0.15mm以上</strong>（即焊盘到覆铜有0.2mm以上的距离）</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__63"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/a78dc50f-e8be-45bb-ae99-b405bd67b28f-file" width="940" height="388"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__64">5）焊接手指上下阻焊开窗要错开<strong>0.3-0.5mm</strong>，防止折断</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__65"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/5104d1b8-596e-49af-a7fe-33b9c87b514e-file" width="991" height="242"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__66">6）按键位及金手指区域阻焊层需要开通窗</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__67"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/0a3d1ed3-8ca3-496a-bc7b-ee31c57236fa-file" width="709" height="355"></span></p>
<p style="text-align: center; line-height: 1.8;"><span class="js_darkmode__67" style="font-size: 14px; color: #888888;">按键位没设计开通窗，阻焊膜切割后无法贴合</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__68">7）尽量减少大面积露铜区域，防止出现皱褶。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__69"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/e73686f2-e470-4e50-b0b7-a07830415d43-file" width="558" height="397"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__70">8）透明板中要做透明效果的区域需要盖阻焊膜</span></p>
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<p style="line-height: 1.8;"><span class="js_darkmode__78">1）补强上有丝印要求时，需要备注一下：补强有丝印。且下单“补强是否有丝印”这个选项要选<strong>“有丝印”</strong></span></p>
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<p style="line-height: 1.8;"><span class="js_darkmode__80">2）补强描述或其它说明性的文字，禁止设计在板内</span></p>
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<section><span style="font-size: 18px; color: #1871ff;"><strong title="" data-original-title="">5.</strong><strong data-brushtype="text">外形设计</strong></span></section>
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<p style="line-height: 1.8;"><span class="js_darkmode__88">1）<strong>外形层必须是唯一的</strong>，一般用GM1或GKO表示，两者只能保留一个，板内非金属化孔圆环或槽的框线也需要放在外形层，外形层不能放任何杂线</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__89"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/cc684975-6c39-4dba-a58e-1015386f8cc9-file" width="616" height="303"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__90">2）FPC外形<strong>不建议设计内直角，或尖角</strong>，外形必须闭合，不能断开</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__91"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/ed53293c-4bb8-4027-9d39-ccd304e9d2e0-file" width="758" height="291"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__92">3）单PCS最大板宽为240mm，SET（含工艺）最大宽度为250mm</span></p>
<p style="line-height: 1.8;"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/d23af0bb-0cdf-4681-adfe-5bf4d1d45339-file" width="590" height="467"></p>
<p style="line-height: 1.8;"><span class="js_darkmode__94">4）焊盘尽量远离外形线0.2mm，否则需要接受激光碳粉问题或改为模冲</span></p>
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<p style="line-height: 1.8;"><span class="js_darkmode__95">5）外形形状不受限制，但板子宽度小于2mm的，切割后会卷起来，需要使用微粘膜固定出货。</span></p>
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<section><span style="font-size: 18px; color: #1871ff;"><strong title="" data-original-title="">6.</strong><strong data-brushtype="text">拼版设计</strong></span></section>
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<p style="line-height: 1.8;"><span class="js_darkmode__104">1）异形板不建议顺拼，建议选择“嘉立创帮拼”中的<span style="color: #1871ff;"><strong>“非常规人工帮拼”</strong></span></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__105"><strong><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/71a27fe0-b5ba-4dc2-9011-5d1a6f487cf2-file" width="1080" height="391"></strong></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__106">2）尺寸要求：</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__107">非SMT板：SET尺寸尽量有一边为79，119或240mm，长度尽量在190mm以内</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__108">FPC+SM<span class="js_darkmode__109">T板：拼板其中一条边强制选用规格79/119/240mm；另一条边维持最低下限≥70mm；有贴片焊盘的SET尺寸长和宽尽量控制200mm以内，最大长度不能超过510mm。</span></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__110">3）有补强的板，<strong>建议四边增加工艺边</strong>，板与板间距按2mm设计，没有补强的最小可以按1mm，灯条板可以0间距。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__111"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/c18bb202-449b-49f3-be4c-8f7fd361e672-file" width="1080" height="523"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__112">5）FPC不能V-CUT或使用邮票孔，而是采用连接点，建议设计成梯形，并<strong>增加防撕裂线</strong></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__113"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/1e5fe989-d7bf-4b8d-980a-2c30fcd08c8e-file" width="712" height="362"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__114">6）拼版时尽可能提高板料利用率，可以节省成本。</span></p>
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<section><span style="font-size: 18px; color: #1871ff;"><strong title="" data-original-title="">7.</strong><strong data-brushtype="text">补强设计</strong></span></section>
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<p style="line-height: 1.8;"><span class="js_darkmode__121">软板在具有轻薄、柔软的同时，也失去了刚性的性能，那么为了使产品指定部位增加一定的厚度和刚性，以便于客户的</span><span style="color: #1871ff;"><strong>后续安装或装配</strong></span><span class="js_darkmode__122">，我们就需要在这些位置贴上一块刚性的板材，即补强板。</span></p>
<p style="line-height: 1.8;"><strong>1）</strong><span class="js_darkmode__123"><strong>PI补强</strong>适用于插拔类金手指区域补强</span></p>
<p style="line-height: 1.8;"><strong>2）</strong><span class="js_darkmode__124"><strong>FR4</strong>适用插件孔区域补强或低端的IC芯片背面</span></p>
<p style="line-height: 1.8;"><strong>3）</strong><span class="js_darkmode__125"><strong>钢片</strong>适用于IC芯片，BGA等器件背面补强，平整度较好，但霍尔元件及插件孔不能使用。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__126"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/b11e5300-1172-4ca1-aef8-fb89988fc161-file" width="1077" height="482"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__127">4）补强区域需比焊盘大<span style="color: #1871ff;"><strong>1.0mm以上</strong></span>，才能有效保护焊盘与线路交接处不断裂。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__128"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/8c83b024-196c-4dc0-a7e4-c46b4b00c330-file" width="479" height="336"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__129">5）补强太窄很难贴合，也容易断裂，需要满足最小宽度，FR4最小宽度3mm，PI最小宽度2mm，钢片最小宽度1mm。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__130" style="font-size: 14px; color: #888888;"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/a9a6a3aa-b83f-4aca-bf36-740599c3ec93-file" width="530" height="278"></span></p>
<p style="text-align: center; line-height: 1.8;"><span class="js_darkmode__130" style="font-size: 14px; color: #888888;">左边钢片宽度小于1mm，无法贴到右边圈住位置</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__131">6）插拔金手指板，补强+FPC的总厚度需要与连接器规格书上要求的厚度相符，下单时要备注清楚，<strong>金手指厚度计算工具：</strong><a class="normal_text_link" href="https://tools.jlc.com/jlcTools/#/calcGoldfingerPIThickness" target="_blank" rel="noopener" data-linktype="2">https://tools.jlc.com/jlcTools/#/calcGoldfingerPIThickness</a></span></p>
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<p style="line-height: 1.8;"><span class="js_darkmode__132">7）<strong>补强避让，</strong>是指补强覆盖到焊盘或孔时，如果想露出焊盘，称为避焊盘，如果只想露孔不露焊盘，称为避孔</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__133"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/9c46e21c-1a6a-4694-9911-b969f4459d85-file" width="568" height="282"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__134">8）FPC也可以像PCB一样做SMT，但设计时尽量不要在有贴片元器件这面设计补强，因为补强有一定的厚度，会导致印锡膏时，落锡不均匀，无法贴件，且不方便维修。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__135"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/853bfd95-3d8a-499e-9267-a87862b90f05-file" width="629" height="239"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__136">9）FPC辅料有很多特殊要求，需要标识清楚，如：3M胶撕手位、补强带手提位、两种补强叠加等。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__137"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/4be29ade-6ef1-4d87-b7d4-42ddc59c7f51-file" width="663" height="754"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__139">10）电磁膜是用来屏蔽电磁干扰的，对阻抗有较大影响，且有电磁膜的板边有可能会导电。电磁膜建议设计<strong>接地阻焊开窗</strong>（默认增加2-3个1.0mm以上开窗），不接地可能吸收电磁波影响信号，务必打样验证。</span></p>
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<p style="line-height: 1.8;"><span class="js_darkmode__146">1）板厚是包含上下层阻焊膜，基材绝缘层和所有铜厚的<strong>总厚度</strong>，局部没有覆铜区域或没有阻焊膜的区域，厚度会相应减薄</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__147"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/a407112a-e9e6-463a-9dee-20b0d78f5863-file" width="1080" height="500"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__148">2）FPC阻抗使用阻抗模拟软件很难计算准确，可参考嘉立创实际总结的经验线宽来设计，有阻抗要求的建议先打样验证，也可咨询嘉立创FPC工程师。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__149"><img style="display: block; margin-left: auto; margin-right: auto;" src="https://pbt-pub.jlc.com/pbt/cms/0a7462ba-af69-4f87-a9f1-54f9329997db-file" width="1080" height="461"></span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__150">3）<strong>阻抗板下单时需要提供阻抗信息</strong>，嘉立创FPC提供阻抗管控服务，但下单时需要选择是否需要此服务。</span></p>
<p style="line-height: 1.8;"><span class="js_darkmode__151">注：线宽线距，铜厚，基材介质厚度，覆盖膜厚度，材料介电常数，电磁膜等都会影响到阻抗，一定要先打样验证OK后，再批量生产。</span></p>
<h2 style="line-height: 1.8;"><span style="color: #1871ff;"><strong><span style="font-size: 20px;">二、FPC设计工具推荐</span></strong></span></h2>
<p style="line-height: 1.6; margin: 0 0 0.6em;"><span class="js_darkmode__152">FPC<span data-pm-slice="1 1 ["para",{"tagName":"section","attributes":{"data-role":"outer","label":"edit by 135editor","style":"margin: 0px;","data-pm-slice":"0 0 []"},"namespaceURI":"http://www.w3.org/1999/xhtml"},"para",{"tagName":"section","attributes":{"data-role":"paragraph","style":"text-align: center;"},"namespaceURI":"http://www.w3.org/1999/xhtml"},"para",{"tagName":"p","attributes":{"style":"text-align:left;margin: 10px 10px 20px;line-height: 1.75;display: block;"},"namespaceURI":"http://www.w3.org/1999/xhtml"},"node",{"tagName":"span","attributes":{"style":"font-size: 14px;letter-spacing: 0.5px;color: #000000;"},"namespaceURI":"http://www.w3.org/1999/xhtml"}]">设计</span>推荐使用<strong>嘉立创EDA专业版2.0及以上版本</strong>，支持FPC补强层设计，可直接放置补强区域并设置材质、厚度，生成Gerber文件时自动同步补强信息，无需额外标注；另外<strong>使用该工具设计FPC，下单还可享立减50元优惠。</strong></span></p>
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<p style="line-height: 1.6; margin: 0 0 0.6em;"><span class="js_darkmode__154">FPC设计的核心是平衡性能与可制造性，嘉立创通过标准化工艺、专业技术服务团队及<strong>12小时快速打样</strong>能力，实现“FPC当天下单，当天发货”，</span><span class="js_darkmode__155">为工程师提供了高效的研发支撑。</span></p>
<p style="line-height: 1.6; margin: 0 0 0.6em;"><span class="js_darkmode__156">遵循本文所述的设计规范，可大幅降低产品不良率，缩短迭代周期。如需更详细的设计教程，可点击<strong><a class="normal_text_link" href="https://www.jlc-fpc.com/technicalDocument/server_guide_43392.html" target="_blank" rel="noopener" data-itemshowtype="0" data-linktype="2">《FPC软板设计入门教程》</a></strong>及<a class="normal_text_link" href="https://www.jlc-fpc.com/designGuide" target="_blank" rel="noopener" data-itemshowtype="0" data-linktype="2">《</a><strong><a class="normal_text_link" href="https://www.jlc-fpc.com/designGuide" target="_blank" rel="noopener" data-itemshowtype="0" data-linktype="2">FPC</a></strong><strong><a class="normal_text_link" href="https://www.jlc-fpc.com/designGuide" target="_blank" rel="noopener" data-itemshowtype="0" data-linktype="2">设计指南》</a><span class="js_darkmode__157">进入页面。</span></strong><br></span></p>
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